• On-chip and 3D interconnect stacks: Synthesis, functionality and performance
• Scaling limitations of interconnects: Metals and dielectrics
• Thermo-mechanical properties and stress: Measurements and simulation
• Role of microstructure and interfaces on mechanical behaviour of nanostructures
• Reliability physics and engineering, damage and failure mechanisms
• Stress-induced degradation phenomena and failure: Cu stress, EM, SIV, TDDB
• Multi-scale modelling, materials data / database
• Advanced materials characterization techniques
• Lifetime and ageing of nanoscale materials, structures and systems
• Design and test for reliability
• Component (device / interconnect) reliability vs. system reliability