- On-chip and 3D interconnect stacks: Synthesis, functionality and performance
- Scaling limitations of interconnects: Metals and dielectrics
- Thermo-mechanical properties and stress: Measurements and simulation
- Role of microstructure and interfaces on mechanical behaviour of nanostructures
- Reliability physics and engineering, damage and failure mechanisms
- Stress-induced degradation phenomena and failure: Cu stress, EM, SIV, TDDB
- Multi-scale modelling, materials data / database
- Advanced materials characterization techniques
- Lifetime and ageing of nanoscale materials, structures and systems
- Design and test for reliability
- Component (device / interconnect) reliability vs. system reliability