topics

  • On-chip and 3D interconnect stacks: Synthesis, functionality and performance
  • Scaling limitations of interconnects: Metals and dielectrics
  • Thermo-mechanical properties and stress: Measurements and simulation
  • Role of microstructure and interfaces on mechanical behaviour of nanostructures
  • Reliability physics and engineering, damage and failure mechanisms
  • Stress-induced degradation phenomena and failure: Cu stress, EM, SIV, TDDB
  • Multi-scale modelling, materials data / database
  • Advanced materials characterization techniques
  • Lifetime and ageing of nanoscale materials, structures and systems
  • Design and test for reliability
  • Component (device / interconnect) reliability vs. system reliability