scope of the conference

The conference will provide a forum for presenting current research and for discussions of future developments related to reliability and stress-induced phenomena in nanoelectronics. Stresses arising in metal structures and surrounding dielectric materials due to novel process steps and advanced materials can lead to degradation and failure of micro- and nanoelectronic products, and therefore, they bring new challenges for process integration, design optimization and reliability. Following the spirit of previous workshops, new research results and advances in basic understanding are emphasized.