co-chairs and scientific committee

Co-Chairs

  • Ehrenfried Zschech, Fraunhofer IKTS, Dresden, Germany
  • Paul Ho, UT Austin/TX, US
  • Jon Molina, IMDEA Materials, Madrid, Spain
  • Tony Oates, TSMC, Taiwan
  • Valeriy Sukharev, Mentor Graphics, Fremont/CA, US

 

Scientific Committee

  • Martin Gall, Fraunhofer IKTS, Dresden, Germany (co-chair)
  • C. K. Hu, IBM Yorktown Heights/NY, US (co-chair)
  • Bob Rosenberg, IBM Yorktown Heights/NY, US (co-chair)
  • Andreas Aal, Volkswagen, Wolfsburg, Germany
  • Reinhold Dauskardt, Stanford University, Palo Alto/CA, US
  • Alex Dommann, EMPA, Switzerland
  • Junichi Koike, Tohoku University, Sendai, Japan
  • Mireille Mouis, CNRS, IMEP-LaHC, Grenoble, France
  • Tomiji Nakamura, Fujitsu, Tokyo, Japan
  • Alexander Narr, GLOBALFOUNDRIES, Dresden, Germany
  • Jungwoo Pyun, Samsung, Korea
  • Riko Radojcic, San Diego/CA, US
  • Olivier Thomas, Aix-Marseille Université, France
  • King-Ning Tu, UCLA, Los Angelos/CA, US
  • Xiaopeng Xu, Synopsys, Mountain View/CA, US